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Ribbon 60mm x 270m AS1F Resin (B-FV4T/B-EX4T2) Thermal Transfer Labels Peel Off moduleThis module strips

SKU: 24425865160
4.1
EUR27.50 EUR68.50

Pay in 4 interest-free payments of $6.88 Learn more

Shipping Estimate
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  • USA
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Ships within 48 hours · Estimated delivery Aug 18 - Aug 23

Description

Peel Off moduleThis module strips the label from the backing paper

and its large capacity means changing media less frequently

the TX200 provides a solution for everything from high volume 4x6 shipping labels to the smallest high-resolution electronic marking applications

The Toshiba B-EX4 comes with premium capabilities standard on board

Wireless LAN module

Ribbon 60mm x 270m AS1F Resin (B-FV4T/B-EX4T2) Thermal Transfer Labels Peel Off moduleThis module stripsRibbon 60mm x 270m AS1F Resin (B FV4T B EX4T2)

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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